BE Semiconductor Industries N.V.

Amsterdam Stock Exchange:BESI.AS

Sector

🤖 Technology

Industries

🔌 Hardware & Electronics

🖨 3D Printing

💻 Computers

💻 Semiconductors

🏗️ Steel

Location

Netherlands

Market Cap

USD 11.29 B

Share Price

USD 141.88

Avg Daily Volume

536,403

Change (1 day)

-1.01%

Change (1 year)

-15.39%

Change (YTD)

3.57%

BE Semiconductor Industries N.V. Inventory for the year ending December 31, 2024: USD 106.95 M

BE Semiconductor Industries N.V. Inventory is USD 106.95 M for the year ending December 31, 2024, a 4.75% change year over year. Inventory is the value of goods held by a company for sale or used in the production process.

BE Semiconductor Industries N.V. Inventory for the year ending December 31, 2023 was USD 102.10 M, a 3.59% change year over year.
BE Semiconductor Industries N.V. Inventory for the year ending December 31, 2022 was USD 98.56 M, a -8.28% change year over year.
BE Semiconductor Industries N.V. Inventory for the year ending December 31, 2021 was USD 107.46 M, a 70.33% change year over year.
BE Semiconductor Industries N.V. Inventory for the year ending December 31, 2020 was USD 63.09 M, a 20.69% change year over year.

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Key data

Date	Inventory	Current Assets	Property, Plant, Equipment (Net)	Total Assets

Amsterdam Stock Exchange: BESI.AS

BE Semiconductor Industries N.V.

CEO	Mr. Richard W. Blickman
IPO Date	July 20, 1998
Location	Netherlands
Headquarters	Ratio 6
Employees	1,820
Sector	🤖 Technology
Industries Hardware & Electronics 🖨 3D Printing 💻 Computers 💻 Semiconductors 🏗️ Steel

Description

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.