Shenzhen FRD Science & Technology Co., Ltd.

Shenzhen Stock Exchange 300602.SZ

Shenzhen FRD Science & Technology Co., Ltd. Current Liabilities for the year ending December 31, 2023: USD 388.56 M

Shenzhen FRD Science & Technology Co., Ltd. Current Liabilities is USD 388.56 M for the year ending December 31, 2023, a -6.49% change year over year. Current liabilities are obligations that are expected to be settled within one year, including accounts payable, short-term debt, and other current liabilities.

Shenzhen FRD Science & Technology Co., Ltd. Current Liabilities for the year ending December 31, 2022 was USD 415.53 M, a 9.61% change year over year.
Shenzhen FRD Science & Technology Co., Ltd. Current Liabilities for the year ending December 31, 2021 was USD 379.11 M, a 53.38% change year over year.
Shenzhen FRD Science & Technology Co., Ltd. Current Liabilities for the year ending December 31, 2020 was USD 247.16 M, a 13.86% change year over year.
Shenzhen FRD Science & Technology Co., Ltd. Current Liabilities for the year ending December 31, 2019 was USD 217.08 M, a 198.51% change year over year.

Key data

Date	Current Liabilities	Total Non-Current Liabilities	Shareholders' Equity	Long-Term Debt

Shenzhen Stock Exchange: 300602.SZ

Shenzhen FRD Science & Technology Co., Ltd.

CEO	Mr. Fuliang Xiang
IPO Date	Jan. 26, 2017
Location	China
Headquarters	FRD Industrial Park
Employees	7,320
Sector	Technology
Industries Hardware & Electronics 3D Printing Automotive Parts Ceramics Composite Materials Containers & Packaging Plastics Semiconductors

Description

Shenzhen FRD Science & Technology Co., Ltd. manufactures and sells EMI shielding materials, thermal interface materials, and other related electronic materials in China, Europe, India, and internationally. Its products include fabric-over-foam and conductive products, metal shielding products, electrically conductive elastomers and plastics, microwave absorbers, graphite films, thermal interface materials, thermally conductive plastics, precision injection, PU reactive hot melting adhesives, and graphic overlays and labels. The company also offers 4G/5G antenna; thermal module and fan; semi solid, squeezing, and vacuum die casting; and charger, wireless charging module, and server power module. It provides its solutions for communication, smart phones, tablet PCs/laptops, PCs/servers, monitors/TVs, power modules, game consoles, and PCB'A. The company was founded in 1993 and is based in Shenzhen, China.

Key trends

Past 5 years