Shenzhen FRD Science & Technology Co., Ltd.

Shenzhen Stock Exchange 300602.SZ

Shenzhen FRD Science & Technology Co., Ltd. Total Non-Current Liabilities for the year ending December 31, 2023: USD 114.84 M

Shenzhen FRD Science & Technology Co., Ltd. Total Non-Current Liabilities is USD 114.84 M for the year ending December 31, 2023, a 5.49% change year over year. Total non-current liabilities are the sum of long-term debt and other non-current liabilities.
  • Shenzhen FRD Science & Technology Co., Ltd. Total Non-Current Liabilities for the year ending December 31, 2022 was USD 108.87 M, a 42.10% change year over year.
  • Shenzhen FRD Science & Technology Co., Ltd. Total Non-Current Liabilities for the year ending December 31, 2021 was USD 76.61 M, a 28.70% change year over year.
  • Shenzhen FRD Science & Technology Co., Ltd. Total Non-Current Liabilities for the year ending December 31, 2020 was USD 59.53 M, a 22.99% change year over year.
  • Shenzhen FRD Science & Technology Co., Ltd. Total Non-Current Liabilities for the year ending December 31, 2019 was USD 48.40 M, a 55.78% change year over year.
Key data
Date Total Non-Current Liabilities Shareholders' Equity Other Liabilities Total Liabilities
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SV Wall Street
Shenzhen Stock Exchange: 300602.SZ

Shenzhen FRD Science & Technology Co., Ltd.

CEO Mr. Fuliang Xiang
IPO Date Jan. 26, 2017
Location China
Headquarters FRD Industrial Park
Employees 7,320
Sector Technology
Industries
Description

Shenzhen FRD Science & Technology Co., Ltd. manufactures and sells EMI shielding materials, thermal interface materials, and other related electronic materials in China, Europe, India, and internationally. Its products include fabric-over-foam and conductive products, metal shielding products, electrically conductive elastomers and plastics, microwave absorbers, graphite films, thermal interface materials, thermally conductive plastics, precision injection, PU reactive hot melting adhesives, and graphic overlays and labels. The company also offers 4G/5G antenna; thermal module and fan; semi solid, squeezing, and vacuum die casting; and charger, wireless charging module, and server power module. It provides its solutions for communication, smart phones, tablet PCs/laptops, PCs/servers, monitors/TVs, power modules, game consoles, and PCB'A. The company was founded in 1993 and is based in Shenzhen, China.

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StockViz Staff

February 3, 2025

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