XiaMen HongXin Electron-tech Group Co.,Ltd

Shenzhen Stock Exchange 300657.SZ

XiaMen HongXin Electron-tech Group Co.,Ltd Total Non-Current Liabilities for the year ending December 31, 2023: USD 60.16 M

XiaMen HongXin Electron-tech Group Co.,Ltd Total Non-Current Liabilities is USD 60.16 M for the year ending December 31, 2023, a -45.16% change year over year. Total non-current liabilities are the sum of long-term debt and other non-current liabilities.

XiaMen HongXin Electron-tech Group Co.,Ltd Total Non-Current Liabilities for the year ending December 31, 2022 was USD 109.69 M, a 10.97% change year over year.
XiaMen HongXin Electron-tech Group Co.,Ltd Total Non-Current Liabilities for the year ending December 31, 2021 was USD 98.84 M, a -22.83% change year over year.
XiaMen HongXin Electron-tech Group Co.,Ltd Total Non-Current Liabilities for the year ending December 31, 2020 was USD 128.09 M, a 303.56% change year over year.
XiaMen HongXin Electron-tech Group Co.,Ltd Total Non-Current Liabilities for the year ending December 31, 2019 was USD 31.74 M, a -26.08% change year over year.

Key data

Date	Total Non-Current Liabilities	Shareholders' Equity	Other Liabilities	Total Liabilities

Shenzhen Stock Exchange: 300657.SZ

XiaMen HongXin Electron-tech Group Co.,Ltd

CEO	Dr. Qiang Li
IPO Date	May 23, 2017
Location	China
Headquarters	19 Hongxin Electronic Industrial Park
Employees	6,221
Sector	Technology
Industries Hardware & Electronics 3D Printing Automotive Parts Composite Materials Computers Plastics Semiconductors Smartphones

Description

XiaMen HongXin Electron-tech Group Co.,Ltd engages in the research and development, design, manufacture, and sale of flexible printed circuit boards (FPCs) in China. It offers thin double-sided, wearable, and fingerprint identification FPCs; rigid-flex, CCM module rigid-flex, and TP and LCD module multilayer boards; and automotive and other LCD modules. The company was founded in 2003 and is based in Xiamen, China.

Key trends

Past 5 years