Taiwan IC Packaging Corporation

Taipei Exchange 3372.TWO

Taiwan IC Packaging Corporation Market Capitalization on January 14, 2025: USD 74.34 M

Taiwan IC Packaging Corporation Market Capitalization is USD 74.34 M on January 14, 2025, a -29.86% change year over year. Market capitalization represents total company value in stock market; higher suggests larger, more established company.
  • Taiwan IC Packaging Corporation 52-week high Market Capitalization is USD 111.58 M on August 01, 2024, which is 50.09% above the current Market Capitalization.
  • Taiwan IC Packaging Corporation 52-week low Market Capitalization is USD 71.62 M on January 13, 2025, which is -3.66% below the current Market Capitalization.
  • Taiwan IC Packaging Corporation average Market Capitalization for the last 52 weeks is USD 94.13 M.
Key data
Date Market Capitalization Share Price Price to Earnings Ratio (P/E) Price to Sales Ratio (P/S)
Market news
Taipei Exchange: 3372.TWO

Taiwan IC Packaging Corporation

CEO Chung-Ho Tseng
IPO Date Dec. 31, 2007
Location
Headquarters Kaohsiung Export Processing Zone
Employees 392
Sector Technology
Industries
Semiconductors Consumer Packaged Goods Containers & Packaging
Description

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.

StockViz Staff

January 15, 2025

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