Taiwan IC Packaging Corporation

Taipei Exchange 3372.TWO

Taiwan IC Packaging Corporation Total Assets for the year ending December 31, 2023: USD 69.28 M

Taiwan IC Packaging Corporation Total Assets is USD 69.28 M for the year ending December 31, 2023, a -10.39% change year over year. Total assets are the total value of all assets owned by a company, representing its resources.
  • Taiwan IC Packaging Corporation Total Assets for the year ending December 31, 2022 was USD 77.32 M, a -18.44% change year over year.
  • Taiwan IC Packaging Corporation Total Assets for the year ending December 31, 2021 was USD 94.80 M, a 23.05% change year over year.
  • Taiwan IC Packaging Corporation Total Assets for the year ending December 31, 2020 was USD 77.04 M, a 10.27% change year over year.
  • Taiwan IC Packaging Corporation Total Assets for the year ending December 31, 2019 was USD 69.86 M, a 3.76% change year over year.
Key data
Date Total Assets Current Liabilities Total Non-Current Liabilities Shareholders' Equity
Market news
Taipei Exchange: 3372.TWO

Taiwan IC Packaging Corporation

CEO Chung-Ho Tseng
IPO Date Dec. 31, 2007
Location
Headquarters Kaohsiung Export Processing Zone
Employees 392
Sector Technology
Industries
Semiconductors Consumer Packaged Goods Containers & Packaging
Description

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.

StockViz Staff

January 15, 2025

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