Kulicke and Soffa Industries Inc

NASDAQ KLIC

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Kulicke and Soffa Industries Inc Retained Earnings To Equity Ratio 5 year CAGR for the year ending September 30, 2023: 10.62%

Kulicke and Soffa Industries Inc Retained Earnings To Equity Ratio 5 year CAGR is 10.62% for the year ending September 30, 2023, a -16.93% change year over year. The retained earnings to equity ratio measures the proportion of a company's retained earnings to its shareholders' equity. It is calculated by dividing the retained earnings by the shareholders' equity. This ratio provides insights into the company's reinvestment of earnings and the level of retained profits relative to shareholders' equity. A higher ratio suggests a higher proportion of earnings being retained for reinvestment or future distribution to shareholders. CAGR, or the Compound Annual Growth Rate, quantifies the mean annual growth rate of an investment or financial metric over a specified time span, considering the influence of compounding. It is instrumental in determining the true annualized return on an investment.

Kulicke and Soffa Industries Inc Retained Earnings To Equity Ratio for the year ending September 30, 2022 was 1.12, a 29.67% change year over year.
Kulicke and Soffa Industries Inc Retained Earnings To Equity Ratio for the year ending September 30, 2021 was 0.87, a 6.55% change year over year.
Kulicke and Soffa Industries Inc Retained Earnings To Equity Ratio for the year ending September 30, 2020 was 0.81, a 5.13% change year over year.
Kulicke and Soffa Industries Inc Retained Earnings To Equity Ratio for the year ending September 30, 2019 was 0.77, a 10.93% change year over year.

NASDAQ: KLIC

Kulicke and Soffa Industries Inc

CEO	Dr. Fusen Ernie Chen
IPO Date	March 26, 1990
Location	Singapore
Headquarters	No. 01-01, 23A Serangoon North Avenue 5, Singapore, Singapore, 554369
Employees	2,925
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment. It also services, maintains, repairs, and upgrades equipment. The company serves semiconductor device manufacturers, integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, industrial manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.

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