Kulicke and Soffa Industries Inc

NASDAQ KLIC

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Kulicke and Soffa Industries Inc Total Liabilities to Total Assets Ratio 1 year YoY Change (%) for the Trailing 12 Months (TTM) ending March 31, 2024: -9.08%

Kulicke and Soffa Industries Inc Total Liabilities to Total Assets Ratio 1 year YoY Change (%) is -9.08% for the Trailing 12 Months (TTM) ending March 31, 2024, a 50.42% change year over year. The total liabilities to total assets ratio measures the proportion of total liabilities to total assets. It is calculated by dividing the total liabilities by the total assets. This ratio provides insights into the company's financial leverage and the proportion of its assets financed by liabilities. A higher ratio indicates a higher level of financial risk and reliance on liabilities for asset acquisition. The measure "Change (%)" refers to the percentage change in the value of a financial metric between two time points. This measure provides a relative perspective on the magnitude of change.

Kulicke and Soffa Industries Inc Total Liabilities to Total Assets Ratio for the Trailing 12 Months (TTM) ending March 31, 2023 was 0.24, a -18.31% change year over year.
Kulicke and Soffa Industries Inc Total Liabilities to Total Assets Ratio for the Trailing 12 Months (TTM) ending March 31, 2022 was 0.30, a 2.50% change year over year.
Kulicke and Soffa Industries Inc Total Liabilities to Total Assets Ratio for the Trailing 12 Months (TTM) ending March 31, 2021 was 0.29, a -5.72% change year over year.
Kulicke and Soffa Industries Inc Total Liabilities to Total Assets Ratio for the Trailing 12 Months (TTM) ending March 31, 2020 was 0.31, a 20.11% change year over year.

NASDAQ: KLIC

Kulicke and Soffa Industries Inc

CEO	Dr. Fusen Ernie Chen
IPO Date	March 26, 1990
Location	Singapore
Headquarters	No. 01-01, 23A Serangoon North Avenue 5, Singapore, Singapore, 554369
Employees	2,925
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment. It also services, maintains, repairs, and upgrades equipment. The company serves semiconductor device manufacturers, integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, industrial manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.

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