Kulicke and Soffa Industries Inc

NASDAQ KLIC

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Kulicke and Soffa Industries Inc Price to Book Ratio (P/B) on June 03, 2024: 2.46

Kulicke and Soffa Industries Inc Price to Book Ratio (P/B) is 2.46 on June 03, 2024, a -0.67% change year over year. The price to book ratio compares the market price per share of a company's stock to its book value per share. It is calculated by dividing the market capitalization by the shareholders' equity minus treasury stock, divided by the number of outstanding shares. This ratio provides insights into how the market values a company relative to its book value. A ratio above 1 indicates the market values the company more than its book value, suggesting positive market sentiment.

Kulicke and Soffa Industries Inc 52-week high Price to Book Ratio (P/B) is 2.91 on August 01, 2023, which is 18.01% above the current Price to Book Ratio (P/B).
Kulicke and Soffa Industries Inc 52-week low Price to Book Ratio (P/B) is 1.97 on October 25, 2023, which is -19.89% below the current Price to Book Ratio (P/B).
Kulicke and Soffa Industries Inc average Price to Book Ratio (P/B) for the last 52 weeks is 2.47.

NASDAQ: KLIC

Kulicke and Soffa Industries Inc

CEO	Dr. Fusen Ernie Chen
IPO Date	March 26, 1990
Location	Singapore
Headquarters	No. 01-01, 23A Serangoon North Avenue 5, Singapore, Singapore, 554369
Employees	2,925
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment. It also services, maintains, repairs, and upgrades equipment. The company serves semiconductor device manufacturers, integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, industrial manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.

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