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Shinko Electric Industries Co., Ltd.

Tokyo Stock Exchange:6967.T

Location

Japan

Market Cap

USD 5.55 B

Share Price

USD 925.40 M

Avg Daily Volume

462,452

Change (1 day)

2,243,511,822.37%

Change (1 year)

2,566,313,161.01%

Change (YTD)

2,546,035,602.27%

Shinko Electric Industries Co., Ltd. Shareholders' Equity for the year ending March 31, 2025: USD 1.89 B

Shinko Electric Industries Co., Ltd. Shareholders' Equity is USD 1.89 B for the year ending March 31, 2025, a 7.90% change year over year. Shareholders' equity are the residual interest in the assets of a company after deducting liabilities, representing the shareholders' ownership claim.
  • Shinko Electric Industries Co., Ltd. Shareholders' Equity for the year ending March 31, 2024 was USD 1.75 B, a -7.34% change year over year.
  • Shinko Electric Industries Co., Ltd. Shareholders' Equity for the year ending March 31, 2023 was USD 1.89 B, a 13.86% change year over year.
  • Shinko Electric Industries Co., Ltd. Shareholders' Equity for the year ending March 31, 2022 was USD 1.66 B, a 19.80% change year over year.
  • Shinko Electric Industries Co., Ltd. Shareholders' Equity for the year ending March 31, 2021 was USD 1.39 B, a 8.21% change year over year.
Key data
Date Shareholders' Equity Cash and Short-Term Investments Receivables Inventory
Market news
Tokyo Stock Exchange: 6967.T

Shinko Electric Industries Co., Ltd.

CEO Mr. Susumu Kurashima
IPO Date Sept. 29, 2005
Location Japan
Headquarters 80, Oshimada-machi
Employees 5,553
Sector 🤖 Technology
Industries
Hardware & Electronics
🖨 3D Printing
🪨 Copper
💻 Semiconductors
Description

Shinko Electric Industries Co., Ltd. manufactures and sells semiconductor packages for semiconductor and electronics manufacturers in Japan. The company offers IC packages, including plastic-BGA substrates, build-up substrates, and lead frames. It also provides molded core embedded package for substitution of package on package and system in package, and small modules; high heat dissipation and high-density flip chip package for automotive infotainment and image processing processors; and module assembly solutions, as well as supports copper pillar, a terminal that connects an interposer with a semiconductor chip by thermal compression flip chip technology. In addition, the company offers various components, such as glass-to-metal seals, heat spreaders, and ceramic electrostatic chucks. Further, it provides testing services in the areas of electrical properties, automatic inspection of solder balls, temperature cycle screening, baking, and tray and tape packing. The company was incorporated in 1946 and is headquartered in Nagano, Japan. Shinko Electric Industries Co., Ltd. is a subsidiary of Fujitsu Limited.

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